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HP PC 290 G9 Tower i3-14100 8GB512 DOS, CT6Y7ATBED

HP PC 290 G9 Tower i3-14100 8GB512 DOS, CT6Y7AT#BED, FreeDOS, Intel Core i3-14100 procesor (4 jezgre / 8 niti, do 4.7 GHz, 12 MB cache), Intel H670/H770 chipset, Intel UHD Graphics 730 integrirana grafika, 8 GB DDR4-3200 RAM (1x8 GB, 2 DIMM utora), 512 GB PCIe NVMe M.2 SSD, Wi-Fi 6 + Bluetooth 5.3, Tower kućište, DVD-RW optički pogon, HP 125 žična tipkovnica i miš, Realtek ALC3867 audio. Priključci: prednji 2x USB-A 10 Gbps, 3x USB-A 5 Gbps, 1x USB-C, audio combo; stražnji 2x USB 2.0, HDMI, DisplayPort, VGA, RJ-45, serijski port, line-in/line-out. Proširenje: 1x PCIe 4.0 x16, 1x PCIe x1, 2x M.2 utora.Napajanje 180 W (90% učinkovitost, aktivni PFC), TPM 2.0 sigurnost, masa 4.7 kg, dimenzije 15.5 x 30.3 x 33.7 cm, 1 godina

1.543 KM
Dostupnost: 3 Dostupno
Spire Termalna pasta SP-700...
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Spire Termalna pasta SP-700 0.5g

Thermal Impedance:＜0.12CW, Thermal Conductivity:＞2.93W/m-K, Colors: silver gray, Dimensions Injection tube: 55×8.5mm (wxd), G.W. Weight: 0.5 Gram, Specific Gravity: ＞1.7, Bleed:＜0.05%, Dialectric Constant:＞5.1(100Hz), Evaporation:＜0.001%, Silicone Compounds: 50%m, Carbon Compounds: 30%, Metal Oxide Compounds: 20%, Application Thermal grease can be used on the rear side of the heatsink, Certifications ROHS, temperature of heating resist instantaneous: -50~240℃, Operation Temperture: -30~180℃

4 KM
Dostupnost: 10 Dostupno
Spire Termalna pasta SP-456 1g
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Spire Termalna pasta SP-456 1g

Thermal Impedance: ＜0.067CW-in2/W, Thermal Conductivity: ＞3.8W/m-K, Colors Silver Grey, Dimensions Injection tube: 51x20x12mm (w x l x h), G.W. Weight: 1 Gram, Specific Gravity: >2.8, Bleed: ＜0.05%, Dialectric Constant: >5.1, Evaporation: 0.001%

4 KM
Dostupnost: 10 Dostupno
Pasta za CPU hladnjak...
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Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance 2.5 Evaporation:

6 KM
Dostupnost: 1000 Dostupno
Pasta za CPU hladnjak...
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Pasta za CPU hladnjak GEMBIRD TG-G3.0-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive

7 KM
Dostupnost: 1000 Dostupno